XPC slim DH270

Chassis
Black chassis made of steel
Dimensions: 190 x 165 x 43 mm (LWH) = 1.35-litre
Weight: 1.3 kg net and 2.04 kg gross
Two holes for Kensington Locks and numerous
threaded holes (M3) at both sides of the chassis

• Operation System
  This system comes without operating system.
  It is compatible with Windows 10 and Linux (64 bit)
  Note: Windows 7 is only supported in combination with 6th generation Intel Core processors “Skylake”.
  For an additional note on Windows 7, please see [1]
• Mainboard / Chipset / BIOS
  Chipset: Intel® H270 Chipset (code name “Union Point”)
  Platform Controller Hub (PCH) as Single-Chip-Solution
  AMI BIOS in 8 Mbit EEPROM with SPI interface
  All capacitors are high quality solid capacitors
  Supports hardware monitoring and watch dog functionality
  Supports Unified Extensible Firmware Interface (UEFI)
  Supports power on after power failure [4]
  Supports Firmware-TPM (fTPM) Version 2.0
• Power Adapter
  External 90 W power adapter (fanless)
  Input: 100~240 V AC, 50/60 Hz
  Output: 19 V DC, 4.74 A, max. 90 W
  DC Connector: 5.5/2.5 mm (outer/inner diameter)
  Remark: The DC-input of the computer supports an external power source with either 12V±5% or 19V±5%.
• Processor support
  Socket LGA 1151 (H4) supports
  Intel Core i7 / i5 / i3, Pentium and Celeron processors
  – 6th generation, code name “Skylake”
  – 7th generation, code name “Kaby Lake”
  Maximum supported processor power consumption (TDP) = 65 W
  14 nm process technology, up to 8 MB of L3 cache
  Not compatible with Intel Xeon E3 V5 processors for socket LGA 1151 and processors with the older Socket LGA 1150.
  Does not support the unlock-function of Intel K-Series processors.
  The processor integrates PCI-Express, memory controller
  and the graphics engine on the same die (performance features
  depending on processor type)
  Please refer to the support list for detailed processor support information at global.shuttle.com.
• Processor cooling
  Heatpipe processor cooling with two 60 mm fans on the upper side of the chassis
• Memory support
  2x SO-DIMM slot with 260 pins
  Supports DDR4-2133/2400 (PC4-17066/19200) SDRAM at 1.2V
  Supports maximum total size of 32 GB (max. 16 GB per module)
  Supports Dual Channel mode
  Supports two unbuffered DIMM modules (no ECC)
• Integrated Graphics
  The features of the integrated graphics function
  depend on the processor type used.
  Three digital video outputs: 1x HDMI 2.0 und 2x HDMI 1.4b
  – supports up to three independent displays simultaneously
  – HDMI 1.4b supports 4K UHD resolution at 30 Hz (2160p/30)
  – HDMI 2.0 supports 4K UHD resolution at 60 Hz (2160p/60)
  – supports Blu-ray (BD) playback with HDCP
  – supports HD video plus multi-channel digital audio via a single cable.
  Optional analog D-Sub/VGA video output [3]
• 2.5″ Storage Bay
  1x 6.35 cm / 2.5″ storage bay supports one hard disk or SSD drive
  Device height: 12.5 mm (max.)
  1x Serial-ATA III connector, max. 6 Gb/s (600 MB/s) bandwidth
  With Serial-ATA power connector (onboard)
• Two M.2 Slots
  This XPC features two M.2 expansion slots:
  (1) M.2 2280 BM slot
  – Interfaces: PCI-Express Gen. 2.0 X4 (max. 16 Gbit/s) and SATA v3.0 (max. 6 Gbit/s)
  – supports M.2 cards with a width of 22 mm
  and a length of 42, 60 or 80 mm (type 2242, 2260, 2280)
  – supports SATA SSDs (BM-Key) or PCIe SSDs (M-Key)
  (2) M.2 2230 AE slot
  – Interfaces: PCI-Express Gen. 2.0 X1 und USB 2.0
  – supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
  – supports an optional WLAN card (accessory WLN-M [4])
• Audio
  Audio Realtek® ALC 662 5.1 channel High-Definition Audio
  Two analog audio connectors (3.5 mm) at the front panel:
  1) 2-channel line out (headphones)
  2) microphone input
  Digital multi-channel audio output: by HDMI
• Dual Gigabit LAN Controller
  Dual network with two RJ45 ports
  Used network chips:
  2x Intel i211 Ethernet Controller with MAC, PHY and PCIe interface
  Supports 10 / 100 / 1.000 MBit/s operation
  Supports WAKE ON LAN (WOL)
  Supports network boot by Preboot eXecution Environment (PXE)
  Supports Teaming mode [5]
• Card Reader
  Integrated card reader
  Supports SD, SDHC and SDXC memory flash cards
  Supports boot up from SD card
• Front Panel connectors
  Microphone input
  Audio Line-out (headphones)
  2x USB 3.0 type A
  1x USB 3.0 type C
  SD card reader
  Power button
  Power LED (blue)
  HDD LED (yellow)
• Back Panel connectors
  1x HDMI 2.0 (supports UltraHD resolution at 60 Hz)
  2x HDMI 1.4b
  (with two screw holes for HDMI connector with locking screws)
  Optional 1x D-Sub VGA connector (Accessory PVG01 [3])
  4x USB 2.0
  2x Gigabit LAN (RJ45)
  2x RS232 serial port, 9-pin D-Sub (5/12 V, 1x RS422/RS485) [6]
  DC-input connector for external power adapter
  4-pin connector (2.54 mm pitch) supports
  – external power on button
  – Clear CMOS function
  – 5 V DC voltage for external components
  2x perforation for optional Wireless LAN antennas
  2x hole for Kensington Locks (at the side)
• Other onboard connectors
  1x jumper JP2 power-on-after-power-fail (hardware solution) [4]
  1x analog VGA graphics output CN6 (2x 10-pin, 1 mm pitch) [3]
  2x serial interface (COM) occupied by back panel connectors
  1x fan connector (4 pins) occupied by cooling system
  1x connector for CMOS battery (occupied)
  1x audio connector (line-out/microphone, 2x 7-pin)
• Supplied Accessories
  Multi-language user guide (EN, DE, FR, ES, JP, KR, SC, TC)
  VESA mount for 75/100mm standard (two metal brackets)
  Four thumbscrews M3 x 5 mm (screws together VESA mount and PC)
  Four screws M4 x 10 mm (to affix VESA mount on the PC)
  Four screws M3 x 4 mm (to mount a 2.5″ drive into the bay)
  Driver DVD (Windows 10 64-bit)
  Serial ATA cable for 2.5″ drive including power cable
  External 90 W power adapter with power cord
  Protection cap for CPU socket (do not use if heat-pipe or fan is mounted)
  Heatsink compound
• Optional Accessies:
  (1) WLN-M: Wireless LAN kit consisting of a M.2-2230 WLAN card, two antennas and appropriate cables. Supports IEEE 802.11b/g/n/ac in the 2.4 / 5 GHz band and Bluetooth 4.0. [7]
  (2) PVG01: optional D-Sub VGA video output [3]
  (3) CXP01: adapter cable for external power button
  (4) PRM01: 2U rack mount front plate for two Shuttle XPC slim PCs
• Environmental Specifications
  Operating temperature range: 0~50 °C [8]
  Relative humidity, non-condensing: 10~90 %
• Certifications / Compliance::
  EMI: FCC, CE, BSMI, C-Tick
  Safety: ETL, CB, BSMI
  Other: RoHS, Energy Star, ErP
  This device is classed as a technical information equipment (ITE) in class B and is intended for use in living room and office. The CE-mark approves the conformity by the EU directives:
  (1) 2004/108/EC relating to electromagnetic compatibility (EMC),
  (2) 2006/95/EC relating to Electrical Equipment designed for use within certain voltage limits (LVD),
  (3) 2009/125/EC relating to ecodesign requirements for energy-related products (ErP)

Footnotes:

[1] Installation of Windows 7
The Intel® 100/200 chipset series does no longer support the Enhanced Host Controller Interface (EHCI) which is the driver software for USB 2.0. The new chipset only supports the updated Extensible Host Controller Interface (xHCI for USB 3.0) which is not supported by the original Windows 7 installation disk. This means, that peripheral devices connected by USB (like keyboard, mouse and external optical drive) will not work during the Windows 7 Installation. As a solution, please add the required USB 3.0 drivers to the Windows 7 installation files – this procedure is explained in the Shuttle FAQ section at http://go.shuttle.eu/skylakewin7en.
Note: Windows 7 is only supported with processors of the 6th generation (Skylake), not with processors of the 7th generation (Kaby Lake).
[2] HDMI output supports DVI-D with optional adapter
[3] Optional D-Sub/VGA connector
The mainboard features one analog graphics port CN6 on the mainboard. This signal can be lead to the outside as a 15-pin D-Sub VGA connector at the backpanel by using an optional adapter PVG01. However doing so means one serial port (COM) less can be used at the backpanel.
[4] Power-on-after-power-fail
The BIOS setup provides a “Power-on-after-power-fail” function that can be found under “Power Management Configuration”. As the name indicates, this function determines the PC’s behaviour after power failure: (1) unconditional power on, (2) restore former status or (3) keep system turned off. As a matter of the nature of this function, it may fail after short power failures. This is why the DH270 also comes with a hardware-based solution. By removing Jumper JP2 (on the mainboard behind the power button), the system will start unconditionally once power is supplied.
[5] Teaming Mode
The teaming function allows you to group both available network adapters together to function as one single adapter. The benefit of this approach is that it enables load balancing and failover.
Driver download: https://downloadcenter.intel.com/download/21642
[6] Serial Ports
This PC features two serial RS232 ports with 9-pin D-Sub connectors at the back panel. The left COM port (COM1) can also be configured as RS422 and RS485 in the BIOS setup. The COM ports are protected by black plastic caps.
Pin 9 of the D-Sub COM-Port is a multi-functional signal. Based on the Jumper JP1 configuration on the mainboard, it can be configured as Ring Indicator (RI) or external power supply with a voltage level of either 5 V or 12 V. Each COM port can be configured separately. The maximum current is 500 mA per connector.
[7] Optional Wireless LAN module
This Shuttle XPC slim Barebone supports the optional Shuttle XPC Accessory WLN-M which consists of a M.2-2230 card with IEEE 802.11ac and BT4.0 functionality and two external antennas with appropriate antenna cables.
[8] Notice – operating temperature
For ambient temperatures over 40 °C we strongly recommend to use SSDs (supporting at least 70 °C) and rugged SO-DIMM memory modules with a temperature range of up to 95 °C.